Karan Pawar
Doctoral Student
Prime Minister's Research Fellow
Indian Institute of Technology Bombay
Mumbai, Maharashtra, India
About Me
I am pursuing a Ph.D. in Mechanical Engineering at the Indian Institute of Technology Bombay. I have received the prestigious Prime Minister's Research Fellowship for my Ph.D. program. I am working on Electroless Deposition as my Ph.D. dissertation. I will develop 3D microstructures on fused silica and use Electroless Plating to deposit a thin seed layer for succeeding electroplating of the microfeatures for MEMS industrial applications.
Education
Ph.D. | Mechanical Engineering
Indian Institute of Technology Bombay
2021 – Present
M.Tech. | Mechanical Engineering
Indian Institute of Technology Bombay
2018 – 2020
B.E. | Mechanical Engineering
University of Mumbai
2014 – 2017
Courses done in PhD
1) MEMS- Design, Fabrication, and Characterization
2) Statistical Design of Experiments
3) Mathematical Methods in Engineering
4) Machining Processes
5) Welding Processes
6) Liquid Material Processing
PhD Progress
Project Title- Electroless seed layer deposition on glass substrates
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Glass is a suitable candidate as a substrate material in microsystems packaging due to electrical insulation, physical strength
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The metallization of the glass is an essential step to realizing glass as a substrate material.
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Limitations of vacuum-based physical vapor deposition to deposit a thin layer for metallization of the glass
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On the contrary electroless deposition process is an all-wet process that metallizes insulating substrates using chemical reactions.
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Electroless deposition is a well-accepted process in the PCB manufacturing industry; however, the adhesion of the electroless deposited layer on the glass is poor.
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My research work includes adhesion improvement of the electroless seed layer, deposition of electroless layers in TGVs, and embedded passive devices.
Objectives
1) Electroless deposition of Nickel and Copper on Glass substrates
2) Adhesion Improvement of Electroless Deposited Layers on Glass Substrates using Mechanical Roughening Processes
3) Electrodeposition of Copper on Electroless Seed Layer to create TGVs
4) Development of 3D microstructures i.e., through glass vias, embedded 3D passive devices on Glass substrates for Microsystems Packaging
Supervisor
Prof. Pradeep Dixit
Associate Professor
Indian Institute of Technology Bombay
2021-2022 Progress
1) Literature review of electroless deposition of copper
Published an article in the Surface Engineering titled A critical review of copper electroless deposition on glass substrates for microsystems packaging applications
2) Adhesion improvement of electroless nickel seed layer using ultrasonic machining-based surface roughening
Presented an article in the 5th World Congress on Micro and Nano Manufacturing 2022, Leuven, Belgium titled Adhesion improvement of the electroless film deposited on glass by the ultrasonic micromachining
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3) Adhesion improvement of electroless nickel seed layer using electrochemical discharge-based surface roughening
Presented an article in the International Conference on Precision, Meso, Micro and Nano Engineering (COPEN12), IIT Kanpur titled Electrochemical Discharge-assisted Roughening to Improve the Adhesion of Electroless Nickel with Glass Substrate
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Camera images of roughened samples
Results of peel adhesion test
SEM image of electroless nickel deposited sample cross section
Journals
Publications
PhD Thesis Research
1) November 2022 A critical review of copper electroless deposition on glass substrates for microsystems packaging applications
Surface Engineering
PhD Side Project
1) July 2022 Investigation of Cu-Sn-Cu transient liquid phase bonding for microsystems packaging
Materials and Manufacturing Processes
MTech Research
1) July 2021 Effect of tool-electrode material in through-hole formation using ECDM process
Materials and Manufacturing Processes
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2) June 2020 Investigations into surface topography of glass microfeatures formed by pulsed electrochemical discharge milling for microsystem applications
Microsystem Technologies
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3) March 2020 Effect of tool electrode-workpiece gap in the microchannel formation by electrochemical discharge machining
ECS Journal of Solid State Science and Technology
International Conferences
PhD Research
1) September 2022 Adhesion improvement of the electroless film deposited on glass by the Ultrasonic micromachining process
World Congress on Micro and Nano Manufacturing 2022, Leuven, Belgium
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MTech Research
1) December 2019 Fabrication of deep microfeatures in glass substrate using electrochemical discharge machining for biomedical and microfluidic applications
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), Singapore
National Conferences
PhD Research
1) December 2022 Electrochemical Discharge-assisted Roughening to Improve the Adhesion of Electroless Nickel with Glass Substrate
International Conference on Precision, Meso, Micro and Nano Engineering (COPEN12), IIT Kanpur
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MTech Research
1) December 2019 Geometrical characteristics and tool wear analysis during multipass microchannel formation in ECDM
International Conference on Precision, Meso, Micro and Nano Engineering (COPEN11), IIT Indore
Get in Touch
Karan Pawar
PhD | Mechanical Engineering
Indian Institute of Technology Bombay
Mobile No.: +91 8898831880